MMIC assembly, wire bonding and flip chip bonding

Contacts :
Camilla Kärnfelt
Pascal Coant (SMD assembly)

We are equipped with several versatile micro-assembly and wire bonding machines in order to be able to build microelectronic, microwave and millimeter wave packages.

The different assembly methods we dispose of are:

  • MMIC chip assembly with silver epoxy à TPT HB16 set up for die bonding and Epotek H20E most often used as conductive adhesive
  • MMIC flip chip assembly using thermo-compression method and gold stud bumps à JFP Microtechnic PP6 flip chip bonder and stud bumps made by TPT HB16
  • IC and MMIC soldered flip chip assembly à JFP Microtechnic PP6 flip chip bonder
  • Small QFP/QNF/BGA package assembly à JFP Microtechnic PP6
  • Regular SMD soldering (down to 0402 size) using solder paste à convection oven or heat plate


The wire bonding methods and material available in house are:

  • Wedgebonding (25 µm gold wire or 33 µm aluminium wire) à TPT HB16
  • Ball bonding (25 µm gold wire) à TPT HB16
  • Ribbon bonding (50 × 12.5 µm gold ribbon) à TPT HB12


For these chip-‘n’-wire techniques we handle naked chips (MMICs, RFIC or ICs) based on GaAs, GaN, InP or Si down to 300 × 300 × 50 µm size


              PP6 flip chip bonder             HB12 wire bonder and HB16 wire and chip die bonder

  • Institut Carnot Télécom & Société numérique
  • Télécom Bretagne Alumni
  • Université Bretagne Loire
  • Fondation Télécom
  • Institut Mines-Telecom
Technopole Brest-Iroise - CS 83818 - 29238 Brest Cedex 3 - France - Tel : 33 (0)2 29 00 11 11 - Fax : 33 (0)2 29 00 10 00